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A specialized chemical substance employed to
selectively eliminate extraneous sections to
establish circuit patterns in semiconductor,
display, and various chip fabrication processes.

A particular chemical substance utilized to
eradicate residual photoresist and
high-molecular-weight polymers following the
etching phase in the semiconductor and
alternative chip production processes.

A chemical agent designed to eradicate organic
and inorganic contaminants that may arise
during chip fabrication procedures, and a
chemical compound employed in purifying
deposition materials from metal masks
throughout the AMOLED production process.

A distinct chemical substance used in the removal
of photoresist & DFR film and similar materials
within the semiconductor and display photoresist
processes.

A specific chemical substance that functions as
a silicon (Si) source during oxide film deposition
on semiconductor wafer surfaces
(oxide film forming agent).

Adhesives and supplementary materials intended
to amplify the binding force of positive and
negative electrode active materials during
secondary battery manufacturing processes.